美國HEC晶振,2012mm,HE-MCC-21-32.768K-12.5,32.768KHZ,進口無源晶振,兩腳貼片晶振,32.768K晶振,2012小體積晶振,無源晶振,SMD晶振,SMD音叉晶體,尺寸2.0x1.2mm,頻率32.768KHZ,負載12.5pF,無鉛環(huán)保晶振,低損耗晶振,低老化晶振,高品質(zhì)晶振,高性能晶振,智能體溫計晶振,智能手表晶振,電子體重秤晶振,藍牙耳機晶振,數(shù)字水表晶振,微處理器時鐘晶振.
美國HEC晶振,2012mm,HE-MCC-21-32.768K-12.5,32.768KHZ特點:
無源晶體具有輕薄小低老化的特點
絕緣電阻：最小500MΩ@直流100V
溫度系數(shù)：-0.034±0.006ppm/℃²
符合ROHS
美國HEC晶振,2012mm,HE-MCC-21-32.768K-12.5,32.768KHZ 參數(shù)表
| ELECTRICAL SPECIFICATIONS | ||||||
| PARAMETERS | CONDITIONS | MINIMUM | STANDARD | MAXIMUM | UNIT | |
| FREQUENCY RANGE | 32.768 | KHz | ||||
| FREQ. TOLERANCE | at 25 °C | ±20 | PPM | |||
| DRIVE LEVEL |
10μW typical 100μW Max. |
|||||
| OPERATING TEMPERATURE | -40 °C to +85 °C | °C | ||||
| STORAGE TEMPERATURE | -40 °C to +85 °C | °C | ||||
| SHUNT CAPACITANCE (CO) | 1.5 | pF | ||||
| LOAD CAPACITANCE (CL) | 12.5 pF | pF | ||||
| ESR | 70KΩ Max. | |||||
| AGING CHARACTERISTICS | ±3 PPM / year | |||||
| TEMPERATURE COEFFICIENT -0.034±0.006ppm/℃² | ||||||
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